Chip and method for producing a chip

US7906352B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Herbert Brunner · Sinzing, DE
• Dieter Eissler · Nittendorf, DE
• Helmut Fischer · Calw, DE
• Ewald Guenther · Regenstauf, DE
• Alexander Heindl · Abensberg, DE

Key dates

• Filing date: Jul 20, 2006
• Grant date: Mar 15, 2011
• Expiry date: Jul 25, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/0361

Abstract

A method is disclosed in which a base body is prepared that comprises a layer sequence intended for the LED chip and suitable for emitting electromagnetic radiation. A cap layer is applied to at least one main surface of the base body. A cavity is introduced into the cap layer and is completely or partially filled with a luminescence conversion material. The luminescence conversion material comprises at least one phosphor. A method is also disclosed in which the cap layer comprises photostructurable material and at least one phosphor, such that it is able to function as a luminescence conversion material and can be photostructured directly. LED chips that are producible by means of the method are also described.