Epoxy resin composition for encapsulating semiconductor element and semiconductor device
US7906378B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 5, 2007 |
| Grant date | Mar 15, 2011 |
| Priority date | — |
| Expiry date | Oct 5, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition for encapsulating a semiconductor element and a semiconductor device manufactured using the epoxy resin composition are provided. The epoxy resin composition includes epoxy resin, a curing agent, at least one kind of an inorganic filler selected from the group consisting of silicates such as talc and calcined clay, oxides such as silica and fused silica, and hydroxides such as aluminum hydroxide and magnesium hydroxide, and a pH buffer agent having a pH buffer area of pH 4 to 8. Further, the semiconductor device is manufactured by encapsulating at least one semiconductor element with a cured product of the above epoxy resin composition. Such a semiconductor device can have excellent moisture resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.