Radial block copolymers and adhesives based thereon with improved die-cutting performance
US7906583B2 · kind B2 · utility
5Cited by
23References
30Claims
0Family size
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Key dates
| Filing date | Oct 31, 2007 |
| Grant date | Mar 15, 2011 |
| Priority date | — |
| Expiry date | Mar 22, 2029 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/24
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Improved adhesives are provided through the use of styrenic radial block copolymers, containing at least 40 wt % diblock copolymers, the adhesives have improved adhesive properties and a reduced elastic behavior under die-cutting conditions. Compared to conventional linear block copolymers of similar molecular weight, radial copolymers offer higher holding power and lower melt viscosity for the adhesive. They therefore contribute to an improved balance between processability and end-use properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.