Shaped MEMS contact
US7906738B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2009 |
| Grant date | Mar 15, 2011 |
| Priority date | — |
| Expiry date | Oct 28, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H2001/0052
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A MEMS switch fabrication process and apparatus inclusive of a bulbous rounded surface movable contact assembly that is integral with the switch movable element and achieving of long contact wear life with low contact electrical resistance. The disclosed process is compatible with semiconductor integrated circuit fabrication materials and procedures and includes an unusual photoresist reflow step in which the bulbous contact shape is quickly defined in three dimensions from more easily achieved integrated circuit mask and etching-defined precursor shapes. A plurality of differing photoresist materials are used in the process. A large part of the contact and contact spring formation used in the invention is accomplished with low temperature processing including electroplating. Alternate processing steps achieving an alloy metal contact structure are included. Use of a subroutine of processing steps to achieve differing but related portions of the electrical contact structure is also included.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.