Arrangement for surface mounting an electrical component by soldering, and electrical component for such an arrangement
US7906739B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2007 |
| Grant date | Mar 15, 2011 |
| Priority date | — |
| Expiry date | Sep 27, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An arrangement may include a substrate and an electrical component. The electrical component may include a base made of an insulating material and a plurality of connection terminals. Each connection terminal is connected to a corresponding connection pad of the substrate by means of a spot of solder paste. The arrangement may further include a block interposed between the substrate and the base of the electrical component. The block may be located substantially on the axis of application of a force for actuating the electrical component and may be designed to inhibit deformation of the base. The block may include a spot of solder paste soldered to an associated conducting pad on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.