Semiconductor device and manufacturing method of the same
US7906852B2 · kind B2 · utility
21Cited by
6References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2007 |
| Grant date | Mar 15, 2011 |
| Priority date | — |
| Expiry date | Apr 5, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device, includes a wiring board; a first semiconductor element mounted on the wiring board; a second semiconductor element mounted on the first semiconductor element so that a position of the second semiconductor element is shifted relative to a position of the first semiconductor element; wherein a part of a main surface of the second semiconductor element faces the first semiconductor element; and an electrode pad provided on the main surface of the second semiconductor element is connected to a second semiconductor element connection pad of the wiring board by a connection part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.