Metallised security element
US7907339B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2005 |
| Grant date | Mar 15, 2011 |
| Priority date | — |
| Expiry date | Sep 23, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03H2001/184
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
The invention concerns a security element (11) in the form of a multi-layer film body, a security document having such a security element and a process for the production of such a security element. The film body on a carrier film (10) has a release layer (20), a protective lacquer layer (21), a replication lacquer layer (22) with relief structures (25, 26), a metal layer (23) and an adhesive layer (24). A first relief structure (25) has a depth-to-width ratio of >0.5, whereby the metal layer (23) is more transparent in the region of the first relief structure (25). A second relief structure (26) has a low depth-to-width ratio whereby the metal layer (23) is less transparent or is opaque in the region of the second relief structure (26).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.