Liquid cooling system
US7907398B2 · kind B2 · utility
21Cited by
13References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2008 |
| Grant date | Mar 15, 2011 |
| Priority date | — |
| Expiry date | Oct 2, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20772
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A liquid cooling system includes a board and a plurality of heat producing components (HPCs) coupled to the board. A mounting structure is located on the board adjacent to the plurality of HPCs. A liquid cooling device is coupled to the mounting structure such that the liquid cooling device engages each of the plurality of HPCs. The liquid cooling device may be decoupled from the mounting structure without detaching liquid conduits that supply it liquid in order to allow for the addition or removal of HPCs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.