Printed circuit board (PCB)with enhanced structural integrity
US7907417B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2008 |
| Grant date | Mar 15, 2011 |
| Priority date | — |
| Expiry date | Aug 13, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A printed circuit board (PCB) is disclose such that the PCB has enhanced structural integrity. The PCB has opposing, outer faces and interlayer interconnects that route RF, power and control signals. Connection areas are formed in or on at least on one face for connecting the interlayer interconnects and any electrical components. A metallic face sheet is secured onto at least one outer face, adding structural rigidity to the multilayer printed wiring board. A metallic face sheet can have apertures positioned to allow access to connection areas. RF components can be carried by a face sheet and operatively connected to connection areas. Antenna elements can be positioned on the same or an opposing face sheet and operatively connected to RF components to form a phased array printed wiring board (PWB) panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.