Circuit board including stubless signal paths and method of making same
US7907418B2 · kind B2 · utility
0Cited by
9References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2009 |
| Grant date | Mar 15, 2011 |
| Priority date | — |
| Expiry date | Dec 1, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board may include first and second sides, a plurality of circuit board layers between the sides, and a plurality of signal traces located in respective circuit board layers. The circuit board layers and the signal traces may extend from a first component connection region at the first side of the circuit board to a second component connection region at the first side of the circuit board. The signal traces may thus form stubless signal paths through the circuit board between the component connection regions. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.