Fluid ejection devices and methods of fabrication
US7909428B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2006 |
| Grant date | Mar 22, 2011 |
| Priority date | — |
| Expiry date | Mar 25, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2002/14475
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A fluid ejection device includes a fluidic layer assembly mounted to a substrate, the fluidic layer assembly having a raised portion formed on a side that faces away from the substrate. A first nozzle is formed through a portion of the fluidic layer assembly other than the raised portion, and a second, larger nozzle is formed through the raised portion. A method of fabricating a fluid ejection device includes applying a first layer of a photoresist material to a substrate and a second layer of a photoresist material to the first layer. A sequence of exposures defines a first region of soluble material in the first layer that becomes the first nozzle and second and third regions of soluble material in the first and second layers, respectively, that jointly become the second nozzle. A region of insoluble material in the second layer becomes the raised portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.