Electrical device having boardless electrical component mounting arrangement
US7909482B2 · kind B2 · utility
11Cited by
222References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 21, 2007 |
| Grant date | Mar 22, 2011 |
| Priority date | — |
| Expiry date | Sep 8, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electrical device such as an LED light assembly includes a conductive circuit and one or more electrical components connected to the circuit. The electrical components and the circuit are at least partially overmolded with a thermoplastic polymer material to encapsulate the components. The material utilized to cover the circuit and/or electrical components may also be utilized to form a housing or other structure of a finished part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.