Patent · US Active

Method for manufacturing silicone wafers

US7909678B2 · kind B2 · utility

0Cited by

7References

7Claims

0Family size

Assignee

Schott AG · DE

Inventors

Andreas Menzel · Jena, DE
Jochen Sigmund · Jena, DE
Christine Fugger · Jena, DE

Key dates

Filing date	Aug 25, 2008
Grant date	Mar 22, 2011
Priority date	—
Expiry date	Mar 19, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A method of manufacturing silicon wafers that include a front surface and a block surface and lateral edges, includes forming a silicon wafer by separating a rectangular, in particular, silicon block with lateral surfaces and before separation, grounding and/or polishing the lateral surfaces of the silicon block parallel to the edge of the silicon wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.