Method of forming a film on a substrate
US7910167B2 · kind B2 · utility
0Cited by
2References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 18, 2005 |
| Grant date | Mar 22, 2011 |
| Priority date | — |
| Expiry date | Oct 23, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D3/142
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A film-forming method of forming a film on a substrate includes performing a surface-improving treatment on the substrate, determining whether a predetermined amount of time has passed since the surface-improving treatment has been performed on the substrate, applying a film-forming solution to the substrate when it is determined that the predetermined amount of time has not passed, and repeating the surface-improving treatment on the substrate when it is determined that the predetermined amount of time has passed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.