Reducing dusting of epoxy laminates
US7910202B2 · kind B2 · utility
0Cited by
14References
11Claims
0Family size
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Inventor
Key dates
| Filing date | Mar 5, 2009 |
| Grant date | Mar 22, 2011 |
| Priority date | — |
| Expiry date | Apr 10, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31703
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Epoxy laminates, e.g. CEM-1 laminates, include polymeric particles, particularly core-shell particles having an average diameter of about 0.05 to 30 μm, which reduce the dust produced during manufacture of printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.