Low thermal expansion bondcoats for thermal barrier coatings
US7910225B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 7, 2007 |
| Grant date | Mar 22, 2011 |
| Priority date | — |
| Expiry date | Jan 21, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This invention relates to low thermal expansion bondcoats for thermal barrier coatings. The bondcoats comprise: (i) an inner layer comprising an inner layer alloy of MCrAlM′, and (ii) an outer layer comprising an outer layer alloy of MCrAlM′, wherein M is an element selected from nickel, cobalt, iron and mixtures thereof, and M′ is an element selected from yttrium, zirconium, hafnium, ytterbium and mixtures thereof. The inner layer alloy is thermally sprayed from a powder having a mean particle size of 50 percentile point in distribution of from about 5 microns to about 50 microns. The outer layer alloy is thermally sprayed from a powder having a mean particle size of 50 percentile point in distribution of from about 30 microns to about 100 microns. The bondcoat has a thermal expansion of about 6.5 millimeters per meter or less between a temperature of from about 25° C. to about 525° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.