Polyamide molding materials with an improved flowability, the production thereof and its use
US7910652B2 · kind B2 · utility
1Cited by
16References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2006 |
| Grant date | Mar 22, 2011 |
| Priority date | — |
| Expiry date | Jul 13, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/25
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to a polyamide moulding compound containing 70 to 99.5% by weight of at least one thermoplastic polyamide and 0.5 to 30% by weight of at least one polyamide oligomer with linear or branched chain structure with a number average molar mass of 800 to 5000 g/mol with basic end groups which are at least partially NH2 end groups, and carboxyl end groups, one of these end groups being present in excess and the concentration of the end group present in excess being at most 300 mmol/kg.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.