Multilayered printed circuit board, solder resist composition, and semiconductor device
US7910836B2 · kind B2 · utility
5Cited by
23References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2007 |
| Grant date | Mar 22, 2011 |
| Priority date | — |
| Expiry date | Aug 14, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4602
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention is to provide a multilayered printed circuit board free from cracks attributed to thermal expansion difference between a solder resist layer and another part and a multilayered printed circuit board of the present invention comprises a conductor circuit and a resin insulating layer serially formed on a substrate in an alternate fashion and in repetition and a solder resist layer formed as an outermost layer, and the solder resist layer contains an inorganic filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.