Light-emitting diode apparatus and manufacturing method thereof
US7910941B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2008 |
| Grant date | Mar 22, 2011 |
| Priority date | — |
| Expiry date | Dec 13, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/882
Abstract
A light-emitting diode (LED) apparatus includes an epitaxial multilayer, a micro/nano rugged layer and an anti-reflection layer. The epitaxial multilayer has a first semiconductor layer, an active layer and a second semiconductor layer in sequence. The micro/nano rugged layer is disposed on the first semiconductor layer of the epitaxial multilayer. The anti-reflection layer is disposed on the micro/nano rugged layer. In addition, a manufacturing method of the LED apparatus is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.