Electronic circuit arrangement and method for producing an electronic circuit arrangement
US7911051B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2006 |
| Grant date | Mar 22, 2011 |
| Priority date | — |
| Expiry date | Jul 30, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic circuit arrangement includes a heat sink and a first circuit carrier which is thermally coupled to the heat sink, lies flat on the latter and is intended to wire electronic components of the circuit arrangement. Provided for at least one electronic component is a special arrangement which is associated with a considerably increased heat dissipation capability for the relevant component and, in addition, also affords further advantages in connection with changes in the population and/or line routing which might occur in practice. The important factor for this is that the component is arranged under a second circuit carrier which is held in a recess in the first circuit carrier. The recess passes through to the top side of the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.