Multi-layer stack platform for cloud communications
US7912983B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2010 |
| Grant date | Mar 22, 2011 |
| Priority date | — |
| Expiry date | Oct 21, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M2203/158
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A multi-layer stack platform is provided for cloud communication connections and services between devices. The system includes three or more layers, including a directory component, an applications component, and a peering component. An interconnection component may also be provided for communication between the applications component and the peering component. The components operate to provide communication services, such as sessions, according to the functionality of a selected application by adhering to device, user, and routing rules and preferences. The device, user, and routing rules and preferences are maintained in and processed by the directory component. The applications component receives communication session requests and accesses corresponding application scripts to perform the requested session. The peering component receives the device, user, and routing rules and preferences, and establishes connection between devices based on, the rules and preferences as defined by the directory component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.