Ultrasonic probe and manufacturing process thereof
US7913366B2 · kind B2 · utility
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2References
9Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 9, 2007 |
| Grant date | Mar 29, 2011 |
| Priority date | — |
| Expiry date | Oct 3, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A manufacturing method for an ultrasonic probe including the steps of forming a plurality of unit fixing plates. Laminating each unit fixing plates to one another to form a fixing base and inserting lead wires into grooves formed in the fixing base. Partially cutting away and smoothing both principal surfaces of the fixing base to expose lead wires. Fixing a piezoelectric plate to one principal surface of the fixing base and cutting out between the lead wires in a one dimension direction and a two dimension direction, to divide up said piezoelectric plate and the fixing base into a plurality of piezoelectric elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.