Film forming apparatus and film forming method
US7913643B2 · kind B2 · utility
3Cited by
8References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2008 |
| Grant date | Mar 29, 2011 |
| Priority date | — |
| Expiry date | Mar 12, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A film forming apparatus is provided which includes a device A that generates liquid fine particles having controlled particle diameters; a device B including a via for guiding the generated liquid fine particles while controlling a temperature thereof; a device C that sprays the guided liquid fine particles; and a device D including a space for forming a transparent conductive film by coating the sprayed liquid fine particles onto a subject to be processed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.