Electroplating apparatus
US7914658B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 13, 2009 |
| Grant date | Mar 29, 2011 |
| Priority date | — |
| Expiry date | Apr 13, 2029 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/04
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for electroplating a rotogravure cylinder out of a plating solution is disclosed. The apparatus includes a plating tank adapted to support the cylinder and to contain a plating solution so that the cylinder is at least partially disposed into the plating solution. The apparatus also includes a non-dissolvable anode at least partially disposed within the plating solution. A current source is electrically connected to the non-dissolvable anode and to the cylinder. An ultrasonic system may be provided to introduce wave energy into the plating solution includes at least one transducer element mountable within the tank and a power generator adapted to provide electrical energy to the transducer element. A holding tank having a circulation pump, a mixing system and heating and cooling elements for the plating solution may be provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.