Electrostatic chuck for substrate stage, electrode used for the chuck, and treating system having the chuck and electrode
US7916447B2 · kind B2 · utility
13Cited by
6References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2004 |
| Grant date | Mar 29, 2011 |
| Priority date | — |
| Expiry date | Jun 25, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6831
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electrostatic chuck is provided for a substrate stage that can be used in plasma treatment of various substrates such as a large-sized glass substrate for a flat panel display (FPD), a semiconductor wafer or the like. The electrostatic chuck is divided into a plurality of electrodes formed into nearly bar-like shapes. In accordance with an exemplary embodiment, each of the divided bar-like electrodes includes an inner electrode and a single layer thermally sprayed film formed on the surface of the inner electrode, with the bar-like electrodes disposed in parallel so as to form a plane electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.