Method for fabricating thin touch sensor panels
US7918019B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2009 |
| Grant date | Apr 5, 2011 |
| Priority date | — |
| Expiry date | Jan 9, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for fabricating thin DITO or SITO touch sensor panels with a thickness less than a minimum thickness tolerance of existing manufacturing equipment. In one embodiment, a sandwich of two thin glass sheets is formed such that the combined thickness of the glass sheets does not drop below the minimum thickness tolerance of existing manufacturing equipment when thin film process is performed on the surfaces of the sandwich during fabrication. The sandwich may eventually be separated to form two thin SITO/DITO panels. In another embodiment, the fabrication process involves laminating two patterned thick substrates, each having at least the minimum thickness tolerance of existing manufacturing equipment. One or both of the sides of the laminated substrates are then thinned so that when the substrates are separated, each is a thin DITO/SITO panel having a thickness less than the minimum thickness tolerance of existing manufacturing equipment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.