Process for attaching components with near-zero standoff to printed circuit boards
US7918381B2 · kind B2 · utility
0Cited by
2References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2005 |
| Grant date | Apr 5, 2011 |
| Priority date | — |
| Expiry date | May 24, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a method and apparatus for mounting electrical components to electric circuit boards. Specifically, the present invention relates to a method for mounting electrical components having near-zero standoff height to electrical printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.