Method of electrodepositing germanium compound materials on a substrate
US7918984B2 · kind B2 · utility
2Cited by
8References
18Claims
0Family size
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Key dates
| Filing date | Sep 17, 2007 |
| Grant date | Apr 5, 2011 |
| Priority date | — |
| Expiry date | Feb 2, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/001
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of electrodepositing germanium compound materials on an exposed region of a substrate structure, which includes forming a plating solution by dissolving at least one germanium salt and at least one salt containing an element other than germanium in water; obtaining a substrate with a clean surface; immersing the substrate in the solution; and electroplating germanium compound materials on the substrate by applying an electrical potential between the substrate and an anode in the plating solution, in which the substrate is included in a semiconductor or phase change device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.