Lidding for a child-resistant blister package
US7919171B2 · kind B2 · utility
14Cited by
2References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 9, 2007 |
| Grant date | Apr 5, 2011 |
| Priority date | — |
| Expiry date | Sep 18, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24661
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A blister package is provided in which the lidding component includes a tear-resistant nonwoven layer and a barrier layer wherein the controlled delamination of the nonwoven layer increases the puncture resistance, thereby improving the child-resistant properties of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.