Method of fabricating micromechanical components with free-standing microstructures or membranes

US7919345B1 · kind B1 · utility

Assignee

• Max-Planck-Gesellschaft zur Föderung der Wissenschaften e.V. · US

Inventors

• Mario Kirsten · Potsdam, DE
• Peter Lange · Eppstein, DE
• Beatrice Wenk · Grenoble, FR
• Werner Riethmueller · Berlin, DE

Key dates

• Filing date: Nov 21, 1995
• Grant date: Apr 5, 2011
• Expiry date: Nov 21, 2015

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/0262
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method is disclosed of fabricating micromechanical components provided with free-standing microstructures or membranes with predetermined mechanical stress, by initially depositing a sacrificial layer on a substrate followed by depositing a polysilicon layer on the sacrificial layer by a gaseous phase deposition and, finally, at least partial removal of the sacrificial layer. During deposition of the polysilicon layer, the process pressure selected determined the type of stress in the polysilicon layer, and the value of the stress is set by the process temperature selected. The process pressure is above the pressure range used in LPCVD reactors.