Method for preparing a cover for protecting a component on a substrate
US7919362B2 · kind B2 · utility
10Cited by
5References
26Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 25, 2008 |
| Grant date | Apr 5, 2011 |
| Priority date | — |
| Expiry date | Jul 30, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0136
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for preparing a cover on a substrate in particular for the encapsulation of electronic, optical, optoelectronic components, of the electromechanical microsystems type, also known as Micro-Electro-Mechanical Systems (MEMS) or optoelectromechanical microsystems, also known as Micro-Opto-Elect-Mechanical systems (MOEMS), joined to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.