Materials for adhesion enhancement of copper film on diffusion barriers

US7919409B2 · kind B2 · utility

Assignee

• AIR PRODUCTS AND CHEMICALS, INC. · US

Inventors

• Hansong Cheng · Singapore, SG
• Xinjian Lei · Vista, US
• Daniel P. Spence · Carlsbad, US
• John Anthony Thomas Norman · Whitehall, US
• David A. Roberts · Fogelsville, US
• Bo Han · Los Angeles, US
• Chenggang Zhou · 红钢城街道, CN
• Jinping Wu · Cuyahoga Falls, US

Key dates

• Filing date: Aug 15, 2008
• Grant date: Apr 5, 2011
• Expiry date: Dec 25, 2028

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/76846
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

We have used the state-of-the-art computational chemistry techniques to identify adhesion promoting layer materials that provide good adhesion of copper seed layer to the adhesion promoting layer and the adhesion promoting layer to the barrier layer. We have identified factors responsible for providing good adhesion of copper layer on various metallic surfaces and circumstances under which agglomeration of copper film occur. Several promising adhesion promoting layer materials based on chromium alloys have been predicted to be able to significantly enhance the adhesion of copper films. Chromium containing complexes of a polydentate β-ketoiminate have been identified as chromium containing precursors to make the alloys with chromium.