Patent · US Active

Integrated coupling structures

US7919909B2 · kind B2 · utility

5Cited by

0References

46Claims

0Family size

Assignee

Delaware Capital Formation, Inc. · US

Inventors

Sabah Sabah · Nashua, US
Jeffrey C. Andle · Bangor, US
Daniel S. Stevens · Stratham, US

Key dates

Filing date	Apr 24, 2009
Grant date	Apr 5, 2011
Priority date	—
Expiry date	Oct 23, 2029

Classification

Technology area (CPC G)Physics
CPC primaryG01L19/083
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

An integrated package provides contactless communication through a coupling mechanism embedded in the package. Package types include Surface Mount Technology (SMT), Low Temperature Co-fired Ceramic (LTCC) technology, and dual-in-line integrated circuit pressed ceramic packages generally. The package can include an acoustic wave device (AWD) sensor such as a surface acoustic wave (SAW) device or a bulk acoustic wave (BAW) device. Coupling includes inductive and capacitive effects through plates, loops, spirals, and coils. Coil inductance and SAW capacitance can be parallel resonant at the desired SAW resonance with the coil impedance higher than the SAW impedance, minimizing load-pull effects.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.