Apparatus and method for nano plasma deposition
US7920369B2 · kind B2 · utility
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Key dates
| Filing date | Jan 23, 2007 |
| Grant date | Apr 5, 2011 |
| Priority date | — |
| Expiry date | Feb 4, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32064
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for initiation and control of a sustained metal plasma and nano plasma (macroparticulate) deposition methods for preparing modified metal coatings are provided. The plasma deposition process can be tightly controlled by virtue of a device that incorporates a plasma arc initiator component and an internal power supply that is capable of controlling dwell time on the target and the size range of particles ejected in the plasma arc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.