Method of manufacturing a rotary sputtering target using a mold
US7922066B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2006 |
| Grant date | Apr 12, 2011 |
| Priority date | — |
| Expiry date | Feb 10, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3491
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The process that is the subject of this invention is a method of making a rotary sputtering target having the steps of providing a cylinder of sputtering target material having an adhesion-wetting layer on its inside surface; providing a stainless steel sputtering target backing tube having an outside diameter smaller than the sputtering target material inside diameter, the backing tube having an adhesion-wetting layer on its outside surface; welding an upper and lower stainless steel retaining ring to the backing tube adjacent to the sputtering target material so that the target material is in compression and the backing tube in tension; and introducing molten bonding material into the annulus between the backing tube and the sputtering target material.The apparatus that is the subject of the present invention is a rotary sputtering target apparatus having a cylinder of sputtering target material; a backing tube having a smaller outside diameter than the inside diameter of the sputtering target material; and bonding material disposed between the target material and backing tube, the bonding material bonding them together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.