RFID packaging and attachment methods and devices
US7922094B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2009 |
| Grant date | Apr 12, 2011 |
| Priority date | — |
| Expiry date | Jun 28, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K19/07786
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
One exemplary electrically conductive, RFID-enabled signage includes (1) an electrically conductive article including an opening and (2) an assembled device that is coupled to the electrically conductive article to provide RFID functionality to the electrically conductive article. One exemplary kit includes (1) an RFID IC arrangement including conductive leads adjacent to an integrated circuit; (2) an insert attached to the RFID IC arrangement; and (3) an attachment device capable of attaching the RFID IC arrangement-insert combination to an electrically conductive signage such that the RFID IC arrangement is positioned to span at least a portion of an opening in the signage and to electrically couple the integrated circuit to the electrically conductive signage. One exemplary method involves providing an assembled device including and RFID IC arrangement and an insert and coupling the assembled device with an electrically conductive signage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.