Method of cutting target members using a cutting saw device
US7922424B2 · kind B2 · utility
29Cited by
22References
25Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 20, 2008 |
| Grant date | Apr 12, 2011 |
| Priority date | — |
| Expiry date | Jun 25, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/9292
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A diamond wire saw and method provides a frame that includes a clamp that attaches to a target (e.g. piling, beam, tubular), an elongated toothed rack extending away from the mount and target, and a moving portion that carries the diamond wire and motor drives that advance the moving portion toward the target and along the toothed rack while driving the wire around roller guides.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.