Low melting point frit paste composition and sealing method for electric element using the same
US7923393B2 · kind B2 · utility
6Cited by
2References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2008 |
| Grant date | Apr 12, 2011 |
| Priority date | — |
| Expiry date | May 14, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/874
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present invention relates to a low melting point frit paste composition and a sealing method for an electric element using the same, and more particularly, to a low melting point frit paste composition which is sealable and appropriate for a flat panel, protects an element weak to heat and improves a process yield with good print properties, and a sealing method for an electric element using the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.