Printed circuit board and method of manufacturing the same
US7923644B2 · kind B2 · utility
47Cited by
9References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2009 |
| Grant date | Apr 12, 2011 |
| Priority date | — |
| Expiry date | Nov 3, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board and method of manufacturing the printed circuit board, including a first and a second write wiring patterns, an end of a first line and an end of a second line of the first write wiring pattern are arranged on both sides of a third line of the second write wiring pattern. Circular connection portions are provided at the ends of the first line and the second line. In addition, through holes are formed in respective portions of a base insulating layer below the connection portions. Each connection portion comes in contact with a connecting region of a suspension body within the through hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.