Light emitting diode package structure and method for fabricating the same
US7923746B2 · kind B2 · utility
1Cited by
4References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 26, 2008 |
| Grant date | Apr 12, 2011 |
| Priority date | — |
| Expiry date | May 26, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8581
Abstract
The present invention discloses a light emitting diode (LED) package structure, which includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on the carrier and has a first opening to expose the carrier, wherein the first protrusion is formed by a thermal conductive material. The LED chip is disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip is 1˜1.5. The adhesion layer is disposed between the LED chip and the carrier to bond the LED chip to the carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.