Patent · US Active

Alignment features for proximity communication

US7923845B2 · kind B2 · utility

2Cited by

3References

19Claims

0Family size

Assignee

Oracle America, Inc. · US

Inventors

Ashok V. Krishnamoorthy · San Diego, US
John E. Cunningham · San Diego, US
James G. Mitchell · Oakdale, US

Key dates

Filing date	Sep 28, 2007
Grant date	Apr 12, 2011
Priority date	—
Expiry date	Nov 7, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/10157
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments of a semiconductor die that includes proximity connectors proximate to a first surface of the semiconductor die are described. This semiconductor die is configured to communicate signals with another semiconductor die via proximity communication through one or more of the proximity connectors. Moreover, the semiconductor die includes a positive feature coupled to a second surface of the semiconductor die that facilitates mechanical alignment of the semiconductor die with the other semiconductor die. Note that a first region around the positive feature defines a first plane, and the positive feature protrudes above the first plane.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.