LED lamp assembly
US7923907B2 · kind B2 · utility
36Cited by
6References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 19, 2009 |
| Grant date | Apr 12, 2011 |
| Priority date | — |
| Expiry date | Jun 25, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S362/80
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A robust LED lamp may be assembly by forming a heat sinking sandwich with two metal heat sinks positioned around the circuit board and pinned together a heat conductive element. The assembly is positioned by pressing it into a base providing electrical connections. The robust assembly is rapidly assembled, thermally effective in draining or spreading heat from the circuit board and is readily adaptable to a variety of applications lighting. The heat sink may be decorated, colored or otherwise esthetically enhanced for consumer appreciation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.