Integrated transportation control for wafer fabrication facility
US7925380B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2006 |
| Grant date | Apr 12, 2011 |
| Priority date | — |
| Expiry date | Mar 30, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
System and method for implementing integrated transportation control in a wafer fabrication facility are described. One embodiment is a factory automation system for a wafer fabrication facility (“fab”) comprising a plurality of bays, wherein each of the bays comprise a plurality of equipment interconnected by an intrabay overhead transport (“OHT”) system, and first and second interbay OHT systems each for interconnecting the intrabay OHT systems. The factory automation system comprises a manufacturing execution system (“MES”) for providing lot information regarding wafers being processed in the fab, a material control system (“MCS”) for providing traffic information regarding transportation of wafers in the fab, and an integrated transportation control (“ITC”) system for using the lot information from the MES and the traffic information from the MCS for selecting a destination and a route to the selected destination for a wafer carrier containing wafers in response to a transfer request.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.