Method for fabricating a clamping device for flexible substrate
US7926170B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2009 |
| Grant date | Apr 19, 2011 |
| Priority date | — |
| Expiry date | Nov 12, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53196
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a clamping device for a flexible substrate is provided. A carrier board having a first positing holes and a plurality of second position holes is provided, wherein the first and the second position holes correspond in position to a plurality of through holes on the flexible substrate. A portion of the carrier board material close to the second position holes is removed to form a hole body and a plurality of curved extending arms connected to the hole body and the carrier board. A first dowel pin and a plurality of second dowel pins are provided for inserting into the first positioning hole and the second positioning holes, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.