Underfill formulation and method of increasing an adhesion property of same
US7926697B2 · kind B2 · utility
5Cited by
1References
11Claims
0Family size
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Key dates
| Filing date | Sep 19, 2007 |
| Grant date | Apr 19, 2011 |
| Priority date | — |
| Expiry date | Jul 2, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S524/919
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An underfill formulation includes a solvent (110), a plurality of amphiphilic block copolymers (120) in the solvent, and an adhesion promoter (130) in the solvent. Groups of the plurality of amphiphilic block copolymers form a plurality of micelles (140) in the solvent, with the micelles including a core (141) and a shell (142) surrounding the core, and the adhesion promoter is in the core of at least some of the plurality of micelles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.