Mold, apparatus including mold, pattern transfer apparatus, and pattern forming method
US7927089B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2006 |
| Grant date | Apr 19, 2011 |
| Priority date | — |
| Expiry date | Nov 21, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB82Y40/00
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A deformable mold includes a first surface at which an imprinting pattern is formed. The imprinting pattern (i) is used to imprint a pattern on a substrate and (ii) has a variable size, which varies based on an amount of deformation of the imprinting pattern. A second surface is located opposite from the first surface in a direction of thickness of the mold. A plurality of heat generating members that generate heat have a permeability to ultraviolet light and are disposed at one of (i) the second surface and (ii) between the first surface and the second surface, and the plurality of heat generating members directly contact the mold in order to control the amount of deformation of the imprinting pattern to vary the size of the imprinting pattern. A controller independently controls the plurality of heat generating members and the controller controls at least one of the heat generating members so as to effect anisotropic size correction of the mold in an in-plane direction of the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.