Superabrasive grain setting method
US7927389B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 17, 2008 |
| Grant date | Apr 19, 2011 |
| Priority date | — |
| Expiry date | Jun 12, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/0009
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a superabrasive grain setting method, a two-dimensionally developed coordinate preparation step is taken, wherein a non-cylindrical area of a mounting surface where a tangential line to the mounting surface in a plane including the axis of the manufacturing mold crosses with the axis of a manufacturing mold is developed into a circular-arc belt-like surface, and a plurality of mounting points are set on the circular-arc belt-like surface in a grid pattern in dependence on mounting positions for superabrasive grains. Then, a rectification step is taken, wherein the grid pattern of the mounting points is rectified in predetermined angular ranges so that the mounting points do not make consecutive point lines in the circumferential direction of the circular-arc belt-like surface. A mounting step is thereafter taken of mounting the superabrasive grains on the mounting surface of the manufacturing mold based on the grid pattern rectified at the rectification step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.