Method of manufacturing an adhesive mount for a leveling device
US7927450B2 · kind B2 · utility
3Cited by
138References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2009 |
| Grant date | Apr 19, 2011 |
| Priority date | — |
| Expiry date | Feb 23, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1093
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of manufacturing a mount includes dispensing a predetermined amount of molten thermoplastic adhesive on a release liner, attaching a tab to the adhesive while the adhesive is at a temperature above its softening point, and cooling the adhesive to a temperature below its softening point.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.