Film adhesive of thermoset resin, curing agent and fibrous micropulp
US7927691B2 · kind B2 · utility
1Cited by
7References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 3, 2009 |
| Grant date | Apr 19, 2011 |
| Priority date | — |
| Expiry date | Apr 20, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2971
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A prepreg composite material that includes a fiber layer and a resin comprising a thermoset resin component, a curing agent and a fibrous micropulp. The micropulp component is an aramid fiber having a volume average length of from 0.01 to 100 micrometers. The prepreg is useful in composite panel construction for minimizing fluid permeation into the cured structure. This prepreg is particularly suitable for making honeycomb sandwich panels. Film adhesives, liquid and paste resins containing aramid fiber micropulp are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.