Semiaromatic polyamide molding compositions and their use
US7927710B2 · kind B2 · utility
14Cited by
2References
32Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 5, 2008 |
| Grant date | Apr 19, 2011 |
| Priority date | — |
| Expiry date | Aug 29, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31739
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyamide molding composition having the constitution from 30 to 100% by weight of at least one 10T/6T copolyamide composed of from 40 to 95 mol % of 10T units, and from 5 to 60 mol % of 6T units, from 0 to 70% by weight of reinforcing materials and/or fillers, and from 0 to 50% by weight of additives and/or further polymers. Uses and processes for the preparation of this polyamide molding composition are described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.